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Samsung Stock Jumps on HBM4E Memory Chip Shipments

Samsung Electronics shares climbed as much as 6.51% after the company began distributing samples of its HBM4E high-bandwidth memory chip to customers worldwide. The 12-layer chip, described as an industry first, delivers speeds up to 16 gigabits-per-second with improved energy efficiency and thermal performance. Samsung's 12-layer HBM4E offers 48-gigabyte capacity, representing a 30% increase versus the previous generation. Samsung plans to expand the product line with an 8-layer 32GB variant and a 16-layer 64GB configuration based on customer needs. High-bandwidth memory chips enable advanced AI systems to process large data volumes rapidly. These chips support accelerators from major technology firms. The announcement follows Samsung's February shipment of HBM4 chips as the company works to strengthen its foothold in next-generation AI memory against competitors SK Hynix and Micron.